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Newsroom
Green Electronics Design Starts with Cadence
Industry leaders are talking about energy efficiency as a product differentiator, an environmental challenge and a financial concern. The chips inside today's electronics are an unseen and untapped opportunity to make a big difference.
Learn more about their conversations
11 Dec 2008
Cadence Unveils Next-Generation Parallel Circuit Simulator for the Verification of Complex Analog and Mixed-Signal IC Designs
10 Dec 2008
Cadence Reports Q3 2008 Revenue of $232 Million and Completion of Accounting Investigation
09 Dec 2008
Cadence Announces Third Quarter 2008 Financial Results Webcast
08 Dec 2008
ChipEstimate.com Announces New IP Partners
04 Dec 2008
Cadence Introduces Industry's First Family of MIPI Standard-Compliant OVM Multi-Language Verification IP
04 Dec 2008
Cadence Provides Open Source OVM Adoption Solution for VMM Users in Response to Industry Demand
03 Dec 2008
Cadence Announces Encounter Digital Implementation System with EDA Industry First End-to-End Parallel Processing Flow
Read more press releases
»
18 Dec 2008
Viewpoint: Low-power design brings chip, software together
-
EE Times
05 Dec 2008
Cadence offers open source OVM solution
-
EE Times
03 Dec 2008
RTL-to-GDSII Multicore Solution
-
Portable Design
03 Dec 2008
Cadence rolls multi-core design solution
-
EE Times
03 Dec 2008
Cadence pulls together the pieces for 45, 32 nm design
-
EDN
02 Dec 2008
Tomorrow's teardown
-
IET
07 Nov 2008
Reclaiming power margins
-
Power Management DesignLine Europe
Read more news
»
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Ronald May
Group Director, Public Relations
408.944.7992
rmay@cadence.com
Nancy Szymanski
Cadence Design Systems, Inc.
408.473.8382
nancy@cadence.com
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